Device Physics and Failure Analysis

Cirrus Logic's in-house Device Physics and Failure Analysis Laboratory investigates device failures through electrical characterization, fault isolation, and physical analysis. Our multidisciplinary team connects observed failure behavior with device-level evidence to support root-cause determination and corrective action.

Cirrus Logic's Process

Cirrus Logic's failure analysis workflow

Each investigation follows a targeted analysis plan, adapting as the evidence leads us toward the root cause.

Sample Preparation

Reconditioning failing devices for analysis

Failure Characterization

Replicate customer-reported failure

Error and Fault Isolation

Thermal, laser, and infrared-based electrical fault isolation

Physical Analysis

Revealing physical evidence of the defect

Reporting and Action

Issue FA report for corrective action

Insight that drives improvement

When failures occur, our Device Physics and Failure Analysis Laboratory turns evidence into actionable root-cause insights that guide containment and corrective action.

Characterize failure

Evaluate customer data and reproduce the reported failure using automated test equipment (ATE) and bench testing.

Isolate the defect

Combine electrical and physical analysis to isolate the defect and investigate the failure mechanism.

Inform corrective action

Document findings to support containment, root-cause review, and improvements to design, manufacturing, and product reliability.

failure analysis

Failure analysis tools and capabilities

Our labs bring together advanced Electrical analysis, Physical analysis, and ESD/latch-up testing capabilities.

Electrical Analysis

Purpose

Failure Analysis Database

Track investigations, review historical failure modes and mechanisms, and identify recurring trends.

WLCSP and SIP Package Reconditioning

Recondition packages for Electrical testing.

Open, Short, and Leakage Testing

Characterize pin-level electrical failures across supported package types.

ATE and Evaluation Board Testing

Reproduce functional failures and establish operating conditions for further analysis.

X-ray and Acoustic Microscopy

Inspect internal package structures and assess package integrity.

Package Decapsulation

Expose the die surface for inspection, probing, and analysis.

Infrared, Laser and Optical-based fault isolation

Support fault isolation using LIT, LEM, OBIRCH, TIVA, and related techniques, including LVP, LVI.

CAD Navigation Tools

Correlate analysis locations with circuit schematics and mask layouts.

Focused-Ion-Beam Circuit Editing

Create Topside/Backside probe access points to modify circuitry for diagnostic testing.

Functional Probing

Measure internal circuit signals to localize failing circuitry.

Atomic Force Microscopy

Perform nanoscale electrical characterization using conductive and tunneling modes.

Physical Analysis

Purpose

Sample Deprocessing

Selectively remove material to expose suspected defects using Dry/Wet/Mechanical Deprocessing.

Dual-Beam FIB/STEM

Prepare targeted cross-sections and image structures at the suspected failure site.

Optical Microscopy

Inspect device structures using immersion, confocal, and laser-scanning imaging.

Ion-Mill Mechanical Cross-Sectioning

Package level mechanical cross sectioning

Scanning Electron Microscopy and Energy-Dispersive X-ray Spectroscopy

Image defects at high resolution and analyze elemental composition.

ESD and latch up

Purpose

JEDEC-Compliant ESD and Latch-Up Testing

Validate device robustness against electrostatic discharge (ESD) and latch-up - enabling design feedback, failure debug, and improved product reliability.

Explore our quality program

The Cirrus Logic quality program spans our fabless operating model, product development, reliability qualification, failure analysis, supplier and customer quality, management systems, and corporate compliance.

Product Development
From initial design through production, quality is built into every stage of our product development process.
Reliability and Qualification
Rigorous qualification and ongoing monitoring help ensure reliable, high-quality products throughout their lifecycle.
Failure Analysis
Remediate errors faster with our in-house Device Physics Lab and extensive failure analysis expertise.
Supplier Management
Learn how we qualify, audit, and monitor manufacturing partners across our supply chain.

Customer Management
Find out how our teams manage quality concerns, communication, and customer support.
ISO Management Systems
Review our ISO-certified quality and environmental management systems, standards, and practices.
Fabless Semiconductor Model
See how we maintain quality across foundry, assembly, test, and production partners.
Product Longevity
See how we support 10+ year product lifecycles through resilient supply planning and strong manufacturing partnerships.

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Cirrus Logic Quality Handbook

The Cirrus Logic Quality Handbook provides a thorough overview of the importance of quality in every facet of our company.

Download handbook